Advanced Packaging Industry 2020 Global Market Growth, Trends, Share and Demands Research Report

 Driven by robust adoption of 5G chipsets in connected devices and smartphones, the Advanced Packaging Market is anticipated to amass significant revenue proceed by 2026. Advanced packaging is used in 5G chipsets to offer low power consumption, high performance and better dimensions. Rising inclination towards 5G technology and a need to expand fab operations is likely to propel industry growth.

A momentous rise in demand for AI and IoT devices has fueled the demand for compact chipsets and advanced packaging solutions. As a result, firms operating in the advanced packaging market are striving towards new product development. For example, in 2020, advanced packaging equipment manufacturer, KLA Corp. announced the launch of Kronos 1190, its new wafer-level packaging inspection system, along with other new products in order to expand the company’s portfolio of advanced packaging systems. With such innovations, Global Market Insights, Inc., suggests that the advanced packaging market may exceed USD 40 billion by 2026.

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Based on packaging type, the market is divided into flip-chip, fan-out, fan-in Wafer Level Packaging (WLP), 2.5D/3D and embedded-die. Estimates suggest that the 2.5D/3D advanced packaging technology segment may grow by 20% over the projected period given to increasing usage of the technology in processors, memory devices and graphical processing units.

Advanced packaging technologies enhances the functionality of memory and processors as well as shrink their size by 30%-40%. Companies have been integrating these packaging technologies into their foundries in order to reduce bulk production cost and improve volume. However, only a few are firms are incorporating 2.5D/3D packaging technologies due to its high installation cost.

In terms of application, the advanced packaging business is divided into aerospace & defense, industrial, consumer electronics, healthcare and automotive. Out of them, the industrial sector is projected to gain a market share of over 5% during the forecast timeframe. This growth can be attributed to proliferating demand for automated machinery and industrial robots in several industries for production, pick & place and related tasks.

Industrial robots are incorporated with high quality chipsets and ICs, which raises the need for advanced packaging to provide better connectivity and sustainability in harsh environments. There is a considerable demand for industrial robots across large scale manufacturing facilities. As per reports, about 2 million new industrial robots are estimated to be installed worldwide by 2022.

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Geographically, Europe advanced packaging market is likely to register 5% CAGR on account of increasing government initiatives regarding the development of the semiconductor industry. European chip makers are focusing on adopting various strategic initiatives such as mergers with manufacturers and collaborations to improve fabrication operations, which may further boost regional market growth.

 

On a global landscape, the advanced packaging market consists of firms such as ASE Group, Sanmina Corporation, Amkor Technology, Inc., Sigurd Microelectronics Corporation, and Chipbond Technology Corporation. These companies are adopting different business strategies like new product launches, integration of innovative packaging technologies and geographical expansions. In 2017, Sanmina Corporation announced the expansion of its technology center in California, providing end-to-end solutions, PCB fabrication & assembly, new product launch and manufacturing services to customers. The company has also added advanced microelectronic packaging, system assembly and surface mount technology to its technology center.

Browse key industry insights spread across 250 pages with 105 market data tables and 43 figures & charts from the report, Advanced Packaging Market in detail along with the table of contents:

https://www.gminsights.com/industry-analysis/advanced-packaging-market

Report Content

Chapter 3.   Advanced Packaging Insights

3.1.  Industry segmentation

3.2.  Industry landscape, 2016 – 2026

3.3.  Impact analysis of corona virus (COVID-19) pandemic on advanced packaging market

3.3.1. Global outlook

3.3.2. Impact by region

3.3.2.1.       North America

3.3.2.2.       Europe

3.3.2.3.       Asia Pacific

3.3.2.4.       Latin America

3.3.2.5.       MEA

3.3.3. Industry value chain

3.3.3.1.       Research and development

3.3.3.2.       Manufacturing

3.3.3.3.       Marketing

3.3.3.4.       Supply

3.3.4. Competitive landscape

3.3.4.1.       Strategy

3.3.4.2.       Distribution network

3.3.4.3.       Business growth

3.4.  Industry ecosystem analysis

3.4.1. Distribution channel

3.4.2. Vendor matrix

3.5.  Technology & innovation landscape

3.6.  Regulatory landscape

3.6.1. North America

3.6.2. Europe

3.6.3. Asia Pacific

3.6.4. LAMEA

3.7.  Industry impact forces

3.7.1. Growth drivers

3.7.1.1.       Rising demand for advanced and miniaturized semiconductor components in consumer electronics

3.7.1.2.       Increasing demand for automotive components in automotive sector

3.7.1.3.       Penetration of 5G technology in developing nations will accelerate the adoption of advanced packaging

3.7.1.4.       Increasing development towards 2.5D/3D technology

3.7.1.5.       Increasing trend towards IoT and AI technology around the globe

3.7.1.6.       Government initiatives to propel semiconductor industry in North America and Europe

3.7.2. Industry pitfalls and challenges

3.7.2.1.   High cost of advanced packaging is hampering the adoption

3.8.  Growth potential analysis

3.9.  Porter’s analysis

3.9.1. Industry rivalry

3.9.2. Threat of new entrants

3.9.3. Buyer power

3.9.4. Supplier power

3.9.5. Threat of substitutes

3.10.      PESTEL analysis

About Global Market Insights

Global Market Insights, Inc., headquartered in Delaware, U.S., is a global market research and consulting service provider; offering syndicated and custom research reports along with growth consulting services. Our business intelligence and industry research reports offer clients with penetrative insights and actionable market data specially designed and presented to aid strategic decision making. These exhaustive reports are designed via a proprietary research methodology and are available for key industries such as chemicals, advanced materials, technology, renewable energy and biotechnology.

 

Contact Us:

Arun Hegde
Corporate Sales, USA
Global Market Insights, Inc.
Phone: 1-302-846-7766
Toll Free: 1-888-689-0688
Email: sales@gminsights.com

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